深圳斯普瑞溙科技有限公司是一家專業(yè)從事半導(dǎo)體后道封裝測(cè)試貼片及邦定工藝相關(guān)耗材、測(cè)試工藝耗材及治具、封裝測(cè)試設(shè)備備件的研發(fā)設(shè)計(jì)、生產(chǎn)、銷售于一體的企業(yè)。公司成立于2009年。 公司擁有一個(gè)半導(dǎo)體制造技術(shù)經(jīng)驗(yàn)豐富的團(tuán)隊(duì)，不定期地與國(guó)外進(jìn)行技術(shù)交流，不斷地進(jìn)行新技術(shù)、新工藝的開發(fā)和改進(jìn)，使公司在半導(dǎo)體封裝測(cè)試工藝日新月異的變化中發(fā)展壯大，技術(shù)得到積累和提升。隨著半導(dǎo)體封裝測(cè)試加工向**薄，**小

時(shí)間：2016-03-31作者：深圳斯普瑞溙科技有限公司瀏覽：629

	      


	      深圳斯普瑞溙科技有限公司是一家專業(yè)從事半導(dǎo)體后道封裝測(cè)試貼片及邦定工藝相關(guān)耗材、測(cè)試工藝耗材及治具、封裝測(cè)試設(shè)備備件的研發(fā)設(shè)計(jì)、生產(chǎn)、銷售于一體的企業(yè)。公司成立于2009年。


	     公司擁有一個(gè)半導(dǎo)體制造技術(shù)經(jīng)驗(yàn)豐富的團(tuán)隊(duì)，不定期地與國(guó)外進(jìn)行技術(shù)交流，不斷地進(jìn)行新技術(shù)、新工藝的開發(fā)和改進(jìn)，使公司在半導(dǎo)體封裝測(cè)試工藝日新月異的變化中發(fā)展壯大，技術(shù)得到積累和提升。隨著半導(dǎo)體封裝測(cè)試加工向**薄，**小的方向發(fā)展，對(duì)相關(guān)的輔助工裝治具及工藝的要求越來(lái)越高，公司通過(guò)使用新的材料，研發(fā)設(shè)計(jì)革新相關(guān)輔助治具，提出工藝改進(jìn)建議，與客戶一起攜手解決遇到的技術(shù)難題，使客戶在低成本，高效率中贏得市場(chǎng)，達(dá)到雙贏效果。


	      公司憑借優(yōu)秀的技術(shù)團(tuán)隊(duì)，高品質(zhì)的產(chǎn)品，準(zhǔn)時(shí)的交貨，優(yōu)質(zhì)的客戶服務(wù)，合理的價(jià)格，已經(jīng)與諸多的國(guó)際，國(guó)內(nèi)的IC封裝廠商建立了長(zhǎng)期的合作關(guān)系，贏得了客戶的認(rèn)可。


	我們提供的產(chǎn)品及服務(wù)如下:


	1)貼片及邦定工藝耗材：陶瓷吸嘴，常溫橡膠吸嘴，高溫橡膠吸嘴，電木吸嘴，引線框架吸嘴，頂針，點(diǎn)膠頭，點(diǎn)膠針，打火桿。


	2）測(cè)試工業(yè)耗材及治具：各種封裝系類的測(cè)試爪/片（QFN,DFN,SOP,DIP,SOT,SOD,TO-XXX),測(cè)試座及POGO PIN,(BGA,QFN,DFN,QFP,FLIP CHIP)


	3)封裝測(cè)試設(shè)備備件（ISMECA,ASM,ESEC,OE,MUHLBAUER)  


	公司網(wǎng)址/  


	


	  Shenzhen Springtech Technology Co., Ltd ,founded in 2009,is a professional supplier of semiconductor assembly and test tooling parts . Our main areas of focus are die bond , wire bond ,testing processes and the related equipment spare parts . We have our own capability in design , manufacturing and assembly in the various fields of the Semiconductor Industry .  


	


	  Springtech has a team of people with rich experience in semiconductor manufacturing . As a technology company , we recognize the importance of technique and innovation . Therefore we place a high priority in areas of co-operation with overseas partners and embrace new technology , process development moving towards smaller and thinner devices , it is a great challenge for the related manufacturing tools . We are ready to take on these challenges and provide solutions using our core techniques , new materials and process development . In short .we hope to help our customers achieve their targets efficiently with low cost and high quality , enabling all parties to be in a win-win situation .


	   With our continuous efforts to pursue technique innovation , high quality , on-time delivery , customer satisfaction with competitive pricing , we managed to establish long-term co-operation with many IC assembly companies, gaining a soild reputation and recogntion from the industry.


	


	Range of products/services:


	1.Die Bond/Wire Bond tooling:


	 - Ceramic collect tip , rubber tip , high temperature rubber tip , Vespel tip , Lead Frame suction cup , Die ejector needle , Epoxy dispensing nozzles , EFO body .


	2.Testing tools:


	 - (for all package types)Contact Fingers , pogo pin , test socket.


	3.Spare parts :


	 - Machine spare parts for ISMECA , ASM , SRM , ESEC , OE , MUHLBAUER and more.

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